Home> News> Sifangda has obtained a patent for polycrystalline diamond and its preparation method, achieving the bonding of diamond particles under the catalysis of the binder
January 09, 2024

Sifangda has obtained a patent for polycrystalline diamond and its preparation method, achieving the bonding of diamond particles under the catalysis of the binder

Sifangda has obtained a patent for polycrystalline diamond and its preparation method, achieving the bonding of diamond particles under the catalysis of the binder. Date: January 5, 2024. Source: DT Semiconductor. According to the announcement of the National Intellectual Property Administration, Henan Sifangda Superhard Materials Co., Ltd. has obtained a patent titled "Polycrystalline Diamond and its Preparation Method, Polycrystalline Diamond Composite Material and its Preparation Method", with the authorization announcement number CN115433847B, and the authorization date is January 2, 2024. Patent abstract: The present invention relates to polycrystalline diamond and its preparation method, as well as polycrystalline diamond composite material and its preparation method, belonging to the field of superhard composite materials technology. The preparation method of the polycrystalline diamond of the present invention involves sequentially subjecting the raw materials to a first-stage high-temperature sintering treatment and a second-stage high-temperature sintering treatment. The first-stage high-temperature sintering treatment can graphitize the surface of the diamond particles and activate (melt) the binder, thereby enabling the binder to be evenly distributed between the diamond particles and on the surface of the particles. The second-stage high-temperature sintering treatment can catalyze the bonding of the diamond particles under the action of the binder, resulting in highly dense and evenly distributed polycrystalline diamond. Due to the longer duration of the first-stage high-temperature sintering treatment, the binder can be fully activated, allowing for more uniform infiltration of the binder into the diamond particles, thereby ensuring better completion of the bonding of the diamond particles in the second-stage high-temperature sintering treatment.
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